On the reliability assessment of trench fieldstop IGBT under atmospheric neutron spectrum

نویسندگان

  • Antoine D. Touboul
  • L. Foro
  • Frederic Wrobel
  • Frédéric Saigné
چکیده

In the early 1990s, active power devices have been shown to be susceptible to radiation-induced failures. Many studies have been focused on cosmic ray-induced power device failures, including even IGBT failures. Till the end of the 1990s, IGBT technologies were susceptible to static or dynamic latch-up, which are respectively occurring in their forward conduction or switching mode. From then on, new technologies, such as trench gate fieldstop IGBTs providing significant improvement in the latching current capability, have been developed. But so far, the impact of atmospheric radiation has not been assessed on actual technologies. With the expected increase of embedded IGBTs in avionics and automotive applications, the impact of neutrons on the functional security of embedded systems has to be quantified. 2011 Elsevier Ltd. All rights reserved.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Assessment of the Trench IGBT reliability: low temperature experimental characterization

The purpose of this study is an assessment of the Trench IGBT reliability at low temperature under static and dynamic operations by the aim of intensive measurements. The analysis of the Trench IGBT behaviour in these conditions is dedicated to the HEV applications. One question can be raised in case of the use of HEV in countries where during winter the temperature drops down -50°C or less: ar...

متن کامل

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions

Two extreme configurations under short circuit conditions leading to the punch through Trench IGBT failure under the effect of the temperature and the gate resistance have been studied. By analyzing internal physical parameters, it was highlighted that the elevation of the temperature causes an acceleration of the failure which is due to a thermal runaway phenomenon, whereas the influence of th...

متن کامل

Failure mechanism of trench IGBT under short-circuit after turn-off

Power semiconductor devices under short-circuit are submitted to high current and high voltage simultaneously that induce high electrical and thermal stresses. Several types of event leading to failure can appear under short circuit conditions in IGBT depending on the device structure, current load and voltage levels. One particular short circuit event appears once the device has turned off. Af...

متن کامل

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation

A systematic methodology is developed in order to clarify the punch through Trench Insulated Gate Bipolar Transistor (T-IGBT) failure mechanisms which can occur under extreme operating conditions such as short circuit and clamped inductive switching. By considering a 2D dimensional physically based device simulation, and by analyzing some T-IGBT physical parameters, it is possible to identify i...

متن کامل

Comparison of temperature limits for Trench silicon IGBT technologies for medium power applications

This work focuses on determining the switching limits in temperature for Reverse Conducting IGBTs and compares them to ‘‘conventional’’ IGBTs based on Trench technologies, all them belonging to 600 V–50 A application scenario. After, their leakage current under blocking state is tested at several working temperatures, in order to study the leakage current that limits the blocking safe operating...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:
  • Microelectronics Reliability

دوره 52  شماره 

صفحات  -

تاریخ انتشار 2012